Angus Rockett received a BS in Physics from Brown University in 1980 and a Ph.D. from the University of Illinois in 1986.  Dr. Rockett is currently a Professor of Materials Science and Engineering at the University of Illinois.  His research interests include sputter deposition and characterization of CuInSe2 for photovoltaics; growth of thin films; microchemical and microstructural analysis of thin films including by TEM, XPS, SIMS, and other methods; modeling of materials, especially semiconductors, using Monte Carlo, density functional theory, and continuum methods; and microelectromechanical systems.  Dr. Rockett has more than 105 publications on these topics as well as on dopant segregation during crystal growth, ion source design, and transition metal oxide and nitride deposition and characterization.  He has presented numerous talks on his work including 35 invited talks.  Dr. Rockett is a Fellow of the American Vacuum Society.  He has been cited on the list of excellent teachers at the University of Illinois and recieved a Xerox Faculty Award for research and an Everett Award for teaching from the College of Engineering at the University of Illinois.  He was an Assistant Dean of Academic Programs in the College of Engineering during the 1993-94 school year and is spending the year 2000 as a member of the technical staff at the U.S. Department of Energy Office of Basic Energy Sciences.  Dr. Rockett has participated in the planning of numerous international conferences for the AVS, TMS, and MRS, and serves on several committees of the AVS.  He is a short course instructor for the AVS (Sputter Deposition of Thin Films) and has given tutorial lectures for the IEEE (“Thin Film Photovoltaics” and “Analysis of Photovoltaic Materials”), at the Argonne National Laboratory (“Ion Beam Analysis Techniques”) and at national meetings of the Chinese, Swedish and Mexican Vacuum Societies.  He is a member of the Editorial Board of the journal Materials Chemistry and Physics and has served as a guest editor of several conference proceedings published in Thin Solid Films and in Vacuum.